Electronics Forum | Wed Jun 06 20:25:06 EDT 2001 | davef
Good machine, good people; yer just about there. Look here for help: http://www.mot.com/SPS/PowerPC/teksupport/teklibrary/papers/BGA_AssemblyRework.pdf http://channel.intel.com/design/quality/component/rework_socketprofiles.htm Earl Moon, a depart
Electronics Forum | Wed Jun 06 13:38:15 EDT 2001 | Michael Parker
To expand on Wolfgangs reply, I suggest you contact your local SRT rep. We recently had the same type of problem as yourself. This is the path we followed. Arrange for operator training, for yourself first, then the operators after you get the machi
Electronics Forum | Wed Jun 06 10:59:43 EDT 2001 | wbu
It�s hard to tell you one good profile for a specific machine cause profiles are mainly dependent on the specific assembly you want to rework. My aproach to this problem is trying to get a close as possible profile as under normal reflow conditions u
Electronics Forum | Wed Jun 06 09:09:28 EDT 2001 | nwyatt
Help! I have been assigned to take over our current rework machine because the profiles have been changed so often and by so many people that they are now not working consistantly. Nobody has been supporting it for the past 2 years and now I have b
Electronics Forum | Fri Apr 09 12:46:10 EDT 1999 | Bob Barr
I have been using an Air-Vac DRS-22 for almost two years with very good results. Once a profile is developed it is very repeatable. The DRS-22 is no longer available, however. It has been replaced by the DRS-24. Unfortunately, the DRS-24 has a lo
Electronics Forum | Tue May 14 20:58:42 EDT 2002 | davef
Maybe the issue is not a proper rework method. Your shorts on the corners are caused by too fast of a profile causing the corners of the BGA to get too hot, too fast, which made them curl, like tatter chips.
Electronics Forum | Tue Mar 20 06:47:56 EDT 2007 | realchunks
I agree with CL. Most people blame the BGA cause it's a mystery chip to most people. Only after replacing the BGA several times do most people look else where. 90% of the time it's something else. Doing all your engineering work up front is the
Electronics Forum | Thu Mar 18 16:39:14 EST 2004 | Jed Johnson
A few good points have been made here: The profile could be ramping too fast. The profile could be gettting too hot. The profile may need to have more "soak" time before reflow to allow the board temperatue to equalize and the board to "relax" and st
Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an
Electronics Forum | Mon Mar 19 11:32:06 EST 2001 | Steve
Have you done any analysis on the failed rework? There could be any one of several reasons, i.e. bad alignment, wrong reflow profile, bad pad plating, etc. More information will help us help you.
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