Electronics Forum: bga shape creation (Page 12 of 14)

De-Bug software for Test

Electronics Forum | Sat Oct 22 22:10:09 EDT 2011 | unisoft

Hi maybe this will help Rich larue rlarue@unisoft-cim.com ProntoGERBER-CONNECTION ( http://www.unisoft-cim.com/gerber_connection.htm ) imports raw Gerber data and allows the user to add intelligent information to the shapes on the display and c

Can anyone tell me that between Mirtek & Kohyoung which AOI machine will be better and why?

Electronics Forum | Mon Feb 16 12:33:58 EST 2015 | ianatvadatech

Hey Syed, I've been running the MV-9 for just over a year. We shopped around very extensively (two APEX shows) before switching from yestech to mirtec and we bought two of the best systems they had to cover the four lines we run. Two systems are fa

Conversion of gerber data into .lst, .aoi, .srf or .asc formats

Electronics Forum | Sun Sep 03 10:05:36 EDT 2017 | unisoft

Hi Unisoft's ProntoGERBER-CONNECTION should help you. ( http://www.unisoft-cim.com/gerber_connection.htm ) -------------- ProntoGERBER-CONNECTION ( http://www.unisoft-cim.com/gerber_connection.htm ) imports raw Gerber data and allows the user to ad

Re: BGA ball size reliability

Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon

| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This

Re: BGA ball size reliability

Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff

| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |

Unusual board with BGA

Electronics Forum | Fri Dec 21 15:32:57 EST 2007 | rwyman

Hey SWAG- Not an uncommon scenario where I'm at. But the bottom line is, as others have said: Profile, profile, profile. Here, we have dedicated profile boards for each product we build and in most cases they're EXACT representations (my library i

uBGA Square Pads or Lands

Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn

| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 19:00:14 EST 1999 | Earl Moon

| | | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot o

It IS possible to rework this BGA socket!!

Electronics Forum | Thu Jan 07 16:46:05 EST 1999 | Steve Gregory

Hey ya'll!! SUCCESS! I was able to get that monster off!...(Now I just gotta' be able to get it back on right...hehehe) If you remember, the whole reason I had to rework it was because somehow they got the hole positions wrong in the board for

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)


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