Electronics Forum | Tue Jan 05 13:26:13 EST 2021 | ppcbs
We are working to upgrade our BGA Rework Systems to place BGA's up to 150mm in size. We are encountering an issue that I wanted to pose to this group. When we get above 50mm in chip size, which is the field of view for the vision systems Prism, the
Electronics Forum | Fri Jun 08 13:29:14 EDT 2001 | dougt
Local fiducials will help component placement but will have no effect on part recognition. Local fiducials help you compensate for board skew or streatch by looking at a small area of the board vs. the board fiducials that cover placement over the e
Electronics Forum | Thu Nov 06 07:54:50 EST 2003 | davef
First, skewing is a perfectly acceptable condition, providing the amount of skewing is not excessive. A-610 provides guidance. Second, this part is a land grid device. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA
Electronics Forum | Mon Jan 13 06:28:15 EST 2003 | johnw
Hi folk's, I'm looking for some help full suggestions here... I've got a ceramic BGA with tn/lead / bismuth balls on it that is over collapsing due to the weight of the momponnet vs the ablity of theball to suppot them. We've spok eto the component
Electronics Forum | Wed Mar 18 07:56:43 EDT 2009 | cyber_wolf
You can calibrate it until you are purple in the face. Job to job and part to part they are just not consistent.They either fail parts or put them on skewed. I have gone back and fourth on this for(10+) years. We have had Fuji look at it and we have
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Wed Feb 07 11:19:23 EST 2001 | CAL
Precision parts and precision boards are nice for the initial evaluation but are costly for routine monthly accuracy tests. I know for a fact all the Siemens machines leaving Germany are evaluated with precision parts and board and placements are eva
Electronics Forum | Tue Jun 02 16:02:13 EDT 1998 | Earl Moon
| First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. | The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part
Electronics Forum | Fri Apr 08 09:32:09 EDT 2005 | bystrom123
We are using a low end Air vac system to place the BGA's. We have X ray we can use. Our CGA's as well use this system. They are one off parts that are above the 20K a piece range. So I have been tasked with making sure all of these procedures are the
Electronics Forum | Tue Sep 21 09:49:50 EDT 2004 | Pomponio Magnus
Has anyone ever seen the distributions that result when plotting percent voiding? (Typically a BGA will have enough balls that you can get oogles of data.) I have seen this and seem to be noticing a pattern. First, they are not all normal, so your
