Electronics Forum: bga solder ball shear testing (Page 1 of 16)

solder ball shear test question

Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef

I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.

solder ball shear test question

Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan

I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.

reflow solder joint shear strength

Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef

Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll

BGA: reworking BGAs, testing and inspection

Electronics Forum | Tue Feb 09 13:47:46 EST 2010 | davef

BGA rework equipment: Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=48736 Use x-ray inspection to identify the obvious defects such as shorts, missing balls and gross solder voids.

BGA testing on the Agilent HP5DX x-ray System

Electronics Forum | Wed Oct 11 09:23:06 EDT 2000 | Roger Squires

Has anyone had any success in finding open circuits (i.e. ball present but not soldered to PCB) under collapsible BGA's using an Agilent HP5DX x-ray tester and the BGA2 algorithm? Can anyone recommend an elongated pad design which produces the neces

solder balls

Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef

Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon

Re: solder land analisys

Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa

| | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d

Re: solder land analisys

Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon

| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe

solder land analisys

Electronics Forum | Thu Jul 15 11:57:15 EDT 1999 | nards penalosa

We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwell

Re: solder land analisys

Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon

| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec

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