Electronics Forum | Wed Oct 04 14:48:49 EDT 2006 | cw
My soak at 150C - 180C for approx. 85sec to 100sec. I believe this is sufficient. I can't change my paste because customer wants to use SnPb paste with SAC solder balls. They claimed that they have sucessful result with other CM. I need to know if
Electronics Forum | Wed Oct 04 14:14:49 EDT 2006 | russ
Change mfgrs of paste OR better yet use pbfree paste, If you are collapsing the balls on the BGA then you are possibly overheating the paste/flux quite a bit. most lead pastes do not like much more than 230 C. I am assuming that you have a decent p
Electronics Forum | Tue Oct 17 09:27:23 EDT 2006 | SWAG
We had a build that showed a relatively high occurence of BGA voids like you were seeing. It was a very small volume first article that took a long time to get through the line so the paste sat on the boards too long. As we ramped up TACT time in p
Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef
We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.
Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr
Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Fri Mar 18 10:18:35 EST 2005 | That's Mr. SMT-Tech to you!!
Here's a good one!!! I've got a customer who is designing a small circuit board, and they want to reflow BGA solder balls directly to the bottomside of the PCB to effectively create a BGA style interface between his PCB and another PCB. Anybody ever
Electronics Forum | Thu Mar 31 07:23:14 EST 2005 | markhoch
Yes! I would like to see the pics. I've already been looking into the SolderQuick system that Dave has recommended, but my customer wants some with 63/37 balls and some SAC305. SolderQuick doesn't have any SAC305 alternatives available as of yet. Tha
Electronics Forum | Sat Mar 26 08:30:01 EST 2005 | davef
Consider this: * SolderQuick Winslow Automation-type [ http://www.winslowautomation.com ] preform * When LGA first came on the scene, we didn't have a clue. After trying sockets, we printed paste on the pads bug-up, reflowed, and then the placed the
