Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef
More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m
Electronics Forum | Thu Mar 03 08:06:36 EST 2011 | scottp
I've seen this with through hole via in pad with soldermask plugging from the opposite side. Baking the boards solved it. Not using such a horrible via in pad method would also have solved it, but that wasn't an option. Is this ball sitting on a v
Electronics Forum | Fri Mar 04 01:08:19 EST 2011 | kemasta
Thanks davef Bridging:- There is no heat sink on the BGA, the heat sink will be fix after relow. I do believe paste had something to do with it, but currently this defect didn't appear so oftenly, so we think that the main root cause is not from the
Electronics Forum | Mon Mar 21 02:54:58 EDT 2011 | kemasta
Hi Dave I agree with the 2nd point (sloppy process management) if the failure rate is higher than 5%. But this is 0.083% case, and only happen once in the blue moon. As I study about the re-flow profile for the last whole week, current parameter se
Electronics Forum | Sat Sep 18 12:10:19 EDT 2004 | Steve Gregory
I have a question about solder masking via's in a BGA pattern, and want to see if I'm thinking correctly about this. This problem is kind of along the same line as Carol's problem earlier. I think it's a bad idea to leave the via's free from solder
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
