Electronics Forum | Fri May 31 23:48:14 EDT 2019 | dhanish
Thanks Dave..My customer proposing to reduce the solder volume.Can the TCT be improved by reducing the stand-off height?
Electronics Forum | Mon Jul 22 13:19:31 EDT 2019 | davef
While we're are it, here's a link to a recent FORUM thread that talk's about BTC standoff height: https://smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=21852&mc=9
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Thu Jun 29 12:36:10 EDT 2000 | Gary
You might try your search with the words Adhesive Dispenser. We recently evaluated machines from Asymtek, a Nordon company, Camalot, and Zmation, and GPD. There are several others. One consideration in the scenario you described is to make sure th
Electronics Forum | Mon Jan 16 10:59:25 EST 2006 | davef
Ken Tacky flux reworked BGA will be perfectly reliable in most customer use environments. We do not have data, but the tacky flux reworked BGA will be less reliable than a BGA reworked with paste [assuming all other factors are the same], because t
Electronics Forum | Thu Oct 08 15:15:49 EDT 2015 | huske
BGA's are by far much easier to process correctly and inspect. As for LGA's you'll never get 100% of the materiel out from under it during the cleaning process. The voiding issue is magnified with and LGA, the low standoff is the reason for the v
Electronics Forum | Mon Nov 01 11:29:30 EST 2004 | davef
There is no IPC requirement for reworking BGA with either paste or just flux. While we generally use flux only, general consensus is that both methods work equally well. Adding solder paste, while more difficult, should result in larger package stand
Electronics Forum | Tue Sep 20 17:39:52 EDT 2005 | russ
If the balls are eutectic (63/37) You shouldn't have any problems. All of our BGA rework is performed without paste. You have plenty of solder to make the joint with the balls themselves. Be wary of cleaning however since the standoff is less.
Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig
Electronics Forum | Sat May 24 00:43:59 EDT 2003 | iman
Our engineers did a study on our medical product with 1mils standoff height, and one issue was 100% of the boards that underwent ultrasonic failed due to failure of the package wirebonding. Poor reflow control would be one area to review in any event
