Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Thu Jul 12 16:17:59 EDT 2007 | bandjwet
We are looking for: 1. A company that sells inspection equipment that can measure the height of solder balls (relative to the plane of the interposer or bottom of the device) OR 2. A service provider who can make some measurements for a user. Any
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Thu May 03 17:34:57 EDT 2001 | oscar mendez
Does any one experienced problems on BGA voids related to height of chip (placement), and also another question, Does any one has some statistical process control for the BGA soldering process? if the answer is yes, I'd like to have advice from you.
Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores
Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove
Electronics Forum | Thu Feb 08 14:03:39 EST 2007 | dave
Hi All, What is the cause of BGA tilt ? I have a failed board and it seems to have approx 0.25 mm difference in height on one edge of the BGA to the other. It is notable under magnification. Is this caused by to much time above reflow temp or not
Electronics Forum | Tue Oct 05 00:10:01 EDT 1999 | karlin
Hi, Help! Could anyone help to enlighten me on this? Question: If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water clean washing ma
Electronics Forum | Tue Oct 05 13:30:23 EDT 1999 | Debbie Alavezos
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Thu Aug 24 09:36:43 EDT 2006 | davef
Medium?? We prefer fully-baked. No, no. It's hearing messages from just about any dead component or board. "Wooo. Chunks. You dove me in the wave solder machine a year ago. I forgive you, because I never saw myself working in a karaoki bar."
Electronics Forum | Thu Aug 21 15:50:12 EDT 2003 | davef
Couple of points are: * You're technically correct that ball height has the potential to vary by 8 thou, but we never see that much variation. Ball heights within a lot of components vary just about nil. * When we place BGA, we smush them into the p
