Electronics Forum | Fri Jun 08 12:05:17 EDT 2007 | bbl
If you're not doing any fine pitch or BGA's, it's a "nice to have". With manual screen printing any paste height measurement tool you got would likely generate more fails than you could deal with unless you set the parameters so wide that almost any
Electronics Forum | Tue Aug 04 11:10:22 EDT 1998 | Chrys
| Hi Stoney, | Justin is giving you some good advice, unfortunately these kinda' problems sometimes call for the ol' D.O.E...otherwise, you could be chasing your tail for a while until you figure out exactly what's causing your problems. | Has
Electronics Forum | Fri Oct 08 17:03:03 EDT 1999 | Dave F
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef
You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a
Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI
What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.
Electronics Forum | Wed Mar 02 10:24:48 EST 2005 | Guest
Balls are 0.30 mm diameter, with a height of 0.24 mm It's a 8*8 mm 184 pins BGA.
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Wed Apr 27 10:47:26 EDT 2005 | HOSS
A 1:1 pad to ball diameter will cause the balls to collapse more giving you less post solder component standoff. Depending on the application of this product and required reliability, you may want to stay with the padstack being used. You may try c
