Electronics Forum | Wed Feb 06 15:51:26 EST 2008 | jax
We have place CSP devices with 0.105mm standoff hights without any issue. The ability to Water Wash all depends on the specifications of your wash... Spray pressure and qty of jets Dwell time, pre-wash/wash/rinse Available detergents or saponifiers
Electronics Forum | Tue May 30 21:14:31 EDT 2000 | Dave F
Sal: JAX makes good points, but I�d like to think about this differently. It sounds like the poorly soldered connection is lifting the whole connector, so that termination floats on top of the solder, rather than submit to the wetting force and be
Electronics Forum | Tue Oct 24 13:41:25 EDT 2006 | jax
Everybody who uses basic "part-type" naming conventions for machine package codes will have this same issue unless restrictions are placed on who, how, and when the package codes can be altered. Some alternative methods to solving this problem: 1. U
Electronics Forum | Fri Nov 23 06:34:43 EST 2012 | bandjwet
With all of the various techniques available for LGA rework including but not limited to: Bumping the part using a polyimide stencil http://www.solder.net/products/stencilmate Bumping the part using a metal fixture or http://www.finetech.de/advance
Electronics Forum | Mon Jun 09 14:09:06 EDT 2014 | jorge_quijano
Hola... I'm in the middle of a project to reduce assembly time in one of our products, this product has a lot of TH connectors to be soldered by hand, I'm implementing PHIR, first run has been completed, the appearance of the solder joints are obvio
Electronics Forum | Tue Dec 29 11:40:24 EST 1998 | Michael Allen
I don't have answers...just comments. We're just starting to assemble CSPs on protos, and I've got the same concerns you have. The MicroBGA package I'm working with has a ball diameter of 0.325mm (0.0128") and a standoff of just 0.010" BEFORE solde
Electronics Forum | Tue Feb 19 11:34:04 EST 2002 | AndyC
Do you mean middle height slice ? . This is a term used to describe the x-ray taken at a mid-ball position on a BGA ball , ie , the "fattest/widest" part if the ball . This is generally done to see if voids contained within have led to fracture acros
Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef
Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
