Electronics Forum | Wed Sep 11 16:57:04 EDT 2002 | bigwop
I've seen this problem caused by the cool down. > On a 7 zone oven I made a profile to peak at zone > 5 to give some semblance of control to the cool > down. The component can develope a big delta T, > because of the difference of materials Che
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Wed Aug 10 16:04:09 EDT 2005 | rrylande
I am concerned about delamination and other modes of damaging the board itself. Am I mistaken to believe that raising the entire board to near reflow temperatures (during the repair of a single BGA) may damage the quality of the board?
Electronics Forum | Wed Aug 10 14:11:38 EDT 2005 | rrylande
Does anyone have suggestions or observations on what my maximum board temperature should be when doing BGA repairs on an SRT? In other words, How hot is too hot? Somebody set the bottom heater on our new BGA repair machine to blow at 275 C, and our
Electronics Forum | Wed Aug 10 17:02:32 EDT 2005 | Inds
wats the thickness of your board.. and the dimension.. I would not heat the board beyond 150deg C.. coz if the board is thick and large.. it will take a long time to reach that temp..and you will burn off your flux.causing poor solder joint. Ind
Electronics Forum | Wed Aug 10 18:14:48 EDT 2005 | rrylande
The boards I am referring to are definitely thick and large. But, on thinner smaller boards, is it OK to bring the board up to those higher temps because it takes less time? Many of the boards I am dealing with (large and small) are reaching 150-15
Electronics Forum | Fri Aug 12 03:54:03 EDT 2005 | Mika
Does the pcba:s comes directly from the assembly line, You are going to do rework on? If faulty pcba:s comes back from, let say a customer from outside or the pcba:s has been on Your shelf for some days/weeks, exposed to open environment (humidity in
Electronics Forum | Wed Aug 10 14:56:03 EDT 2005 | pjc
"Too Hot" is any more heat than what is needed to reflow the solder. You should have the Auto-Profile software for the machine, this will accurately monitor and record temps. There is also port for the component itself to monitor package temp. There
Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw
Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an
Electronics Forum | Mon Aug 11 10:37:19 EDT 2008 | realchunks
I assume you mean the balls of the BGA, not pads (laugh it up guys - I said balls). If so, you may have a no-lead BGA or a high temp BGA.
