Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef
This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold
Electronics Forum | Wed Aug 24 08:43:45 EDT 2005 | PWH
What kind of problems/defects/process indicators are you having? It is likely that you will have to bite the bullet and get a thermal profiling mole to prove that your selected profiles are subjecting parts to the correct tempertures per part specs.
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Electronics Forum | Mon Jun 04 10:40:37 EDT 2012 | davef
I'm not aware of any such stipulation about witness [probe] marks for assembled boards, per se. Certainly, witness marks should not affect the intended performance of the assembly, you know, like damaging the solder connection or smudging solder mate
Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon
| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over
Electronics Forum | Wed Mar 17 19:00:14 EST 1999 | Earl Moon
| | | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot o
Electronics Forum | Thu Oct 15 17:20:25 EDT 1998 | Justin Medernach
| | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | Q: Can you get away with sp
Electronics Forum | Thu Oct 15 14:33:37 EDT 1998 | Earl Moon
| | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | Q: Can you get away with spending
Electronics Forum | Wed Aug 22 10:57:59 EDT 2001 | wbu
Hi Steven, BGA�s are known for their ability to self align and from own experiance they do. There�s enough documentation on this one available (...don�t have the links present like Dave but I�m sure he will give you enough to spend some evenings rea
Electronics Forum | Tue Mar 13 16:05:30 EST 2001 | rob_thomas
Hi, can you definitely attribute the 30%yield to poor bga soldering? What is your high flyer defect encountered on the failed boards.Is this ICT ,flying probe ,functional test yield? Can you determine a defect pattern? Did your subcontractor provided
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