Electronics Forum: bga void specification ipc (Page 13 of 14)

Re: Qualifying new PWB Vendors

Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: Popcorn @ reflow

Electronics Forum | Thu May 20 03:34:56 EDT 1999 | Earl Moon

| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | | Omat baby, Mo

Re: Popcorn @ reflow

Electronics Forum | Fri May 21 13:57:02 EDT 1999 | KA Stillings

| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | |

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 02:14:39 EST 1999 | Joe

| | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of

Re: DFM Guidelines or solderability?

Electronics Forum | Thu Aug 20 15:29:45 EDT 1998 | D. Lange

Re: Questions #2 Are you having solderability problems with that arrangement? Sounds like problems could be solved at the wave solder. If the customer has already spun pcb then sometimes for low volume it would be easier to correct the problem at wa

Re: No Free Beer But...

Electronics Forum | Mon Oct 19 14:24:06 EDT 1998 | Justin Medernach

| | | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | | Q:

Re: Popcorn @ reflow

Electronics Forum | Thu May 20 15:07:12 EDT 1999 | JohnW

Earl, your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of the compon

Re: Popcorn @ reflow

Electronics Forum | Sat May 22 19:38:59 EDT 1999 | Omat Marasigan

| Earl, | | your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? | | anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of

Re: 20 mil pitch applications

Electronics Forum | Tue Jan 12 00:33:30 EST 1999 | Jason

| | Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow

Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h


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