Electronics Forum: bga void specification ipc (Page 14 of 14)

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow

Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h

Re: Moisture sensitive device processing

Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon

| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very

Dye Penetration test for area array package failure analysis

Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef

First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis

BGA Rework

Electronics Forum | Fri May 09 09:09:22 EDT 2003 | fmonette

Phil, here is why "dry cabinet storage may not stop the clock" : The moisture diffusion inside a component is actually quite complex. When previously exposed components are returned to dry storage, the moisture gradient that is already absorbed in

Re: Why are squares better than round ones?(and a update on my lil' nightmare)

Electronics Forum | Wed Apr 28 12:18:04 EDT 1999 | Scott McKee

| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area

Re: Why are squares better than round ones?(and a update on my lil' nightmare)

Electronics Forum | Wed Apr 28 11:16:45 EDT 1999 | Steve Gregory

Hello all, I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area of th

Re: Need help on DFM rules

Electronics Forum | Wed Jun 02 15:27:27 EDT 1999 | JohnW

| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where

Solder Paste Inspection Criteria

Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis

The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ

Previous 9 10 11 12 13 14  

bga void specification ipc searches for Companies, Equipment, Machines, Suppliers & Information

Association Connecting Electronics Industries (IPC)
Association Connecting Electronics Industries (IPC)

IPC is the trade association for the printed wiring board and electronics assembly industries.

Training Provider / Events Organizer / Association / Non-Profit

3000 Lakeside Drive, 309 S
Bannockburn, IL USA

Phone: 847-615-7100

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Selective Soldering Nozzles

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
SMT spare parts

Low-cost, self-paced, online training on electronics manufacturing fundamentals