Electronics Forum | Tue Nov 10 07:37:32 EST 2009 | scottp
I'm curious why your customer is concerned with BGA voiding. Normal process voids, even well in excess of IPC "limits", don't effect reliability so why monkey with the process to get rid of a non-issue?
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
Electronics Forum | Mon Feb 11 17:21:40 EST 2008 | larryd
What causes BGA voids over 25%? Have recommended profile for solder paste, hit 237C for 5 seconds and still get a void on 2% of specific BGA in various locations. BGA is FG676, 1mm pitch, on ImAg using lead free paste OM338 on a 6 layer FR4 PCB.
Electronics Forum | Thu Oct 11 13:10:04 EDT 2012 | anvil1021
We are experimenting with void control in reflow and have had pretty good luck for the most part in attaining Class lll IPC spec. but we have seen a sudden increase in voiding on a specific product and I was wondering if anyone has seen this extreme
Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul
I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15
Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris
Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks
Electronics Forum | Thu Nov 21 08:20:32 EST 2019 | scotceltic
Ok, Question for all of you quality inspectors out there. Would you consider the IC image here to have excessive voiding given the amount of vias ? I only see an IPC voiding spec on BGA balls but nothing for IC's. I'd appreciate all your thoughts
Electronics Forum | Tue Nov 10 12:23:38 EST 2009 | CL
Good Morning, I agree. This has been a problem job for us. They are looking for anything that could be implicated. Right now, they are focusing on the profile. My question pertains to the frequency of micro voiding on BGA devices. I have seen some
Electronics Forum | Thu May 20 21:16:46 EDT 2010 | erli
Hi Pat According IPC-610D voids biger 25% are considered defects. You need verify you Pre Heat and try to reduce the ramp. Its very importante verify if the BGA`s are avoid hummity. Erli
Electronics Forum | Fri Sep 03 06:53:38 EDT 2010 | arjan
Yes, we assembled a lot of QFN in the last years, but we don't have a X-ray machine by ourself, so we cant't inspect each device. This type LGA was designed on a prototyping board of our customer so we would validate our LGA reflow process and a rese
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