Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon
My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Tue Sep 21 09:49:50 EDT 2004 | Pomponio Magnus
Has anyone ever seen the distributions that result when plotting percent voiding? (Typically a BGA will have enough balls that you can get oogles of data.) I have seen this and seem to be noticing a pattern. First, they are not all normal, so your
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas
We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss
Electronics Forum | Tue Apr 13 13:18:50 EDT 2004 | arcandspark
David F. thanks for information about the copper plating issues, I will check out the Indium site as you suggest. You are right about Thermount being Unreworkable, but T.I. makes us do it due to the cost of these RF proto types, $250 each bard board.
Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
Electronics Forum | Wed Oct 14 16:58:30 EDT 1998 | Earl Moon
| It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | Q: Can you get away with spending 25K? 30K? H
Electronics Forum | Tue Feb 27 22:40:28 EST 2007 | davef
IPC-A-600G, 2.9 Solder Resist [Solder Mask] [snip]"Solder resists are used to limit and control the application of solder to selected areas of the printed circuit board during assembly soldering operations and are sometimes used to reduce dendritic f
Electronics Forum | Tue Mar 01 15:13:22 EST 2011 | felixgutierrez
Hi Everyone. I would like your input in regards to lead free solder paste lead free. Which one is the most reliable solder for BGA's and BTC's (QFN). I have used different type of solder and on some of them i get big voids on BTC's and other one i g
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