Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef
I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.
Electronics Forum | Wed Sep 11 13:20:37 EDT 2002 | stepheno
I've seen this problem caused by the cool down. On a 7 zone oven I made a profile to peak at zone 5 to give some semblance of control to the cool down. The component can develope a big delta T, because of the difference of materials
Electronics Forum | Wed Sep 11 16:57:04 EDT 2002 | bigwop
I've seen this problem caused by the cool down. > On a 7 zone oven I made a profile to peak at zone > 5 to give some semblance of control to the cool > down. The component can develope a big delta T, > because of the difference of materials Che
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Wed Sep 29 02:40:45 EDT 1999 | Robert
Hi All, Any one experince BGA-chipset warp about 10-15mil after removing from PCB? FYI, the rework temperature for preheat was 170C from room temperature about 30 seconds, & BGA was removed at temperature between 190-200C. Thankyou. BRs, Robert
Electronics Forum | Fri Aug 30 11:17:19 EDT 2013 | jth
Hi, the BGA and/or the PCB may be warping excessively during reflow. We offer testing services to measure warpage of BGAs and PCBs during reflow to JEDEC and IPC standards. Let me know if you'd like to learn more about our services: joe@zntechnolo
Electronics Forum | Wed Sep 29 03:41:32 EDT 1999 | Wolfgang Busko
| Hi All, | Any one experince BGA-chipset warp about 10-15mil after removing | from PCB? | FYI, the rework temperature for preheat was 170C from room | temperature about 30 seconds, & BGA was removed at temperature | between 190-200C. | Thankyou.
Electronics Forum | Wed Sep 29 22:50:57 EDT 1999 | Dave F
| Hi All, | Any one experince BGA-chipset warp about 10-15mil after removing | from PCB? | FYI, the rework temperature for preheat was 170C from room | temperature about 30 seconds, & BGA was removed at temperature | between 190-200C. | Thankyou.
Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
