Electronics Forum | Tue Apr 23 14:30:35 EDT 2019 | scotceltic
I would like to setup a guideline for BGA to components around it minimum distance. To allow for rework possibilities of the BGA. What are people using as a minimum clearance out there ?
Electronics Forum | Tue Jul 24 09:15:47 EDT 2001 | gdstanton
Folks, Does anyone have data to support that a minimum clearance left around the perimeter of a BGA on a board design can improve its solderability? In other words, if X distance is left open (free of components) around the BGA, could ball solderab
Electronics Forum | Thu Apr 25 05:17:08 EDT 2019 | pdrirrework
Hello All, Using IR will mean that there is no minimum distance to the adjacent components as there is not hot air flow. If components are heat sensitive around the BGA you can also tape them off with a reflective tape. The IR heat will bounce strai
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Tue Sep 19 09:41:30 EDT 2017 | sumote
Steve, The 4 things I would do, and in this order: 1. Clean your stencil with stencil cleaner wipes after it comes out of the stencil cleaner. I like MicroCare ProClean (MCC-PROWR). I will even saturate the wipe with a bit of isopropal just till
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc
A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th
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