Electronics Forum | Fri May 17 14:23:34 EDT 2002 | dason_c
I will convinced to change to the no clean process by environmental safe even though clean process is water soluble but it still produce the waste. Also, the BGA is not recommend to clean, if the flux is not completed removed from the board and elec
Electronics Forum | Fri Jun 09 01:27:07 EDT 2006 | Scott
Thanks for the info. I've been able to arrange some training with the local branch of Samsung, who are getting engineers from Korea to come over to teach us. It sounds like an exercise in wasted time and manpower to me, but that's what you get I supp
Electronics Forum | Thu Dec 13 11:55:41 EST 2007 | realchunks
You're right. I do care too much. I should work on that. I guess it is better to just point out a problem ina meeting and waste resourses, rather than resolve it.
Electronics Forum | Wed Feb 13 09:17:47 EST 2008 | scottp
The causes of voids are extremely paste dependent. I did a literature search a couple years ago and the papers all disagreed with each other - one would say turn knob "A" to the right and the next would tell you to turn it to the left. I did my own
Electronics Forum | Tue Feb 11 13:12:25 EST 2003 | Jim Mills
Use a PCB fab house that is capable of "Conductive Via Filling" is the way to do it right. A conductive epoxy is used to fill the drilled via PRIOR to final plating. After final plating, the surface of the "Filled Via" will appear to be the same as t
Electronics Forum | Fri Jun 16 15:05:29 EDT 2006 | grantp
Hi, We ran some boards and the girl on the line put in some Pb BGA's instead of using RoHS parts. This should not have happened as we have almost no Pb parts left, and we spray painted Pb parts fluorescent pink so it was obvious. The boards seem t
Electronics Forum | Tue Jul 29 09:47:40 EDT 2003 | davef
We agree with Russ and Ioan that rework does not cause black pad. It's caused during the board fabrication process. On the other hand, we think: * Mantis wants to reduce the amount of reworking of boards that fail due to a black pad problem. *
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Wed Jun 13 13:50:49 EDT 2001 | DaveG
I don't have any actual "hard" data to give on improvements but, I can share some experiences with you. What we noticed when we implemented the Rheo pump was: No more solder "skips" on our boards, Improved print quality on our BGA's & 16mil fine pitc
