Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Fri Aug 30 11:17:19 EDT 2013 | jth
Hi, the BGA and/or the PCB may be warping excessively during reflow. We offer testing services to measure warpage of BGAs and PCBs during reflow to JEDEC and IPC standards. Let me know if you'd like to learn more about our services: joe@zntechnolo
Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Mon Jun 17 19:10:04 EDT 2013 | hegemon
You have not mentioned exactly how the BGA was reflowed onto the board. Was it sent through the oven again after the mini-stencil, or was it heateed up and reflowed using a BGA rework station, or other hot air device?? From the sound of it (outside
Electronics Forum | Wed Sep 11 16:57:04 EDT 2002 | bigwop
I've seen this problem caused by the cool down. > On a 7 zone oven I made a profile to peak at zone > 5 to give some semblance of control to the cool > down. The component can develope a big delta T, > because of the difference of materials Che
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Fri Oct 27 23:08:58 EDT 2006 | KEN
slow your heating ramp down. You are "tater-chipping" the BGA.
Electronics Forum | Fri Oct 27 07:39:54 EDT 2006 | jdumont
Just wondering if anyone has seen this problem before. We are using a 456 ball FPGA and during installation on our BGA rework machine the corners curl up causing opens there. The part was profiled with our KIC and matches the paste MFG spec. Is this
Electronics Forum | Fri Oct 27 08:19:53 EDT 2006 | davef
Josh: Search the fine SMTnet Archives for background discussions. For further discussion on the "being hosed by the physics": http://www.cooksonsemi.com/tech_art/pdfs/Controlling%20Warpage.pdf
Electronics Forum | Fri Oct 27 09:05:28 EDT 2006 | jdumont
Thanks a lot for the suggestions. I will try baking and see what develops. For the record the parts are stored in nitrogen atmos. under 5% RH. Doesnt mean they werent overexposed when they got here however... JD
