Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq
Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!
Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
Electronics Forum | Wed Aug 10 13:31:05 EDT 2005 | patrickbruneel
Joseph, In addition to my previous post The reason why the cracks are most visible at the transformer location is due to the weight of the transformer. The stress on the boards is the highest because the weight of the transformer will warp the board
Electronics Forum | Thu Nov 29 16:00:03 EST 2007 | jmelson
Desoldering often applies a LOT more heat and thermal stress to the part, and maybe mechanical forces while everything is hot, to get the part free of the board. So, a lot of damage might be done there, making post-mortem harder. Without the leads,
Electronics Forum | Sat Sep 30 10:04:39 EDT 2006 | daxman
I found this pot, and tried adjusting it. It was already turned to its maximum, and the histogram did not look good. I tried replacing the board lamp and this helped the histogram a lot, but I am not able to get the bars centered in the green. The
Electronics Forum | Thu Mar 04 19:27:33 EST 2004 | russ
what I have usually found although not from wave conveyor chains but from racing motorcycles is that binding is caused by wear and bending and not dirt unless it is excessive to the point that you can actually see the dirt that is binding it. When t
Electronics Forum | Thu Mar 04 10:07:46 EST 2004 | Chris Lampron
Sorry about the non SMT post, but I figured that there might be someone with a similar experience out there. We have been having a tough time cleaning the conveyor chains in our wave solder machine. We have been cleaning them in a self cleaning oven,
Electronics Forum | Mon Nov 19 21:25:07 EST 2007 | davef
J Webster: Can you send / post pix of your cracked capacitors? What do you think about our assumptions? They are: * No flex in end-item use * Supplier has no defective packaging * No hand soldering of these parts * No impact or flex from ATE * No H2
