Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin
| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s
Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon
Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Thu Sep 18 15:26:04 EDT 2008 | ismir
Dear Hegemon, I'm very grateful for your help. There is one more thing that I'd like to discuss with you. I'd like to know if there is any "verification board" or something like that to check if you really did a good job. At the company where I wo
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef
Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen
Electronics Forum | Sun Jan 14 12:42:35 EST 2007 | SMTRework
I think the main cause of this condition is #3 because both #1 and #2 never change from board to board, these are identical boards with identical BGA revisions. These BGA's (as stated before) are about 3 years old.. I don't believe they are lead free
Electronics Forum | Thu Sep 13 22:06:02 EDT 2007 | davef
While you're waiting for others to respond, here's one take on bismuth in lead-free soldering [ http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Articles⊂section=Display&ARTICLE_ID=229915 ] by a long term friend of SMTnet. Find more by sea
Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong
Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,
Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB
As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p
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