Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef
Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.
Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno
We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with
Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic
We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l
Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson
This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l
Electronics Forum | Thu Jun 30 03:14:34 EDT 2016 | andrzej
Looks like "black pad" issue. More about this here: http://www.ipc.org/feature-article.aspx?aid=Black-pad Definitly PCB supplier need to improve the process.
Electronics Forum | Wed Aug 24 22:11:36 EDT 2016 | davef
I'd guess that "black pad" is not the issue that you need to address, because only 2 of your 5 test points has the problem that we seem to be discussing. I'd expect "black pad" problems to be more wide spread. Something is going on at those two locat
Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef
On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you
Electronics Forum | Mon Aug 22 22:40:52 EDT 2016 | twhoo
analysis report is as attached. Pls let me know what you think of the root cause of this issue? Can i conclude this is a black pad at thru hole ring with a root cause of contaminated gold
Electronics Forum | Mon Aug 29 08:44:57 EDT 2016 | jrrt_williams
As an OEM repiar tech I would run into "Black Pad" on occasion, though mostly on surface mount pads. The only way I could remove the oxidation was to apply water soluble flux and add solder, then wick away the excess. This left me with a suitable s
