Electronics Forum | Thu Mar 02 11:56:04 EST 2000 | Dave Pearcy
We are experiencing the same problem. We just spent $1,200 to figure out that the "black stuff" is a Nickel Oxide. I am going to look into the profile end of this problem. Any suggestions would be very helpful. Dave
Electronics Forum | Thu Mar 02 11:56:04 EST 2000 | Dave Pearcy
We are experiencing the same problem. We just spent $1,200 to figure out that the "black stuff" is a Nickel Oxide. I am going to look into the profile end of this problem. Any suggestions would be very helpful. Dave
Electronics Forum | Mon Apr 18 11:26:38 EDT 2005 | davef
Whenever we hear "gold" and "balls falling off", we think of black pad [hypercorrosion of nickel]. What does your EDX show?
Electronics Forum | Thu Aug 29 09:55:37 EDT 2002 | davef
Sounds like hyper-corrosion of nickel, commonly referred to as 'black pad', in ENIG solderability protected boards. Search the fine SMTnet Archives to get started. Additionally, the July - September 2002 'Journal Of Surface Mount Technolgy' has an
Electronics Forum | Tue Dec 05 21:19:14 EST 2006 | Jack
Hi Doug, I think you are right..Let me do some EDX on other location to see any nickel oxide...BTW, is this black pad reworkable?? If yes, how? Thanks in advance,..
Electronics Forum | Wed Apr 21 17:08:32 EDT 2004 | dave
Congratulations on your new customer. This could be a keeper. Here's what you're familiar with: Electroless Nickel - per MIL-C-26074 and ASTM-B733. Electroless nickel describes the plating of nickel deposits, which may contain phosphorus and boro
Electronics Forum | Tue Jan 10 20:56:45 EST 2006 | davef
Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b343900f7010VgnVCM100000f932a8c0
Electronics Forum | Wed Jun 14 20:49:32 EDT 2006 | davef
We too do not use ENIG. Too expensive and risky. Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Mon Nov 03 11:20:08 EST 2008 | boardhouse
Vlad, That was a bad statement to make... Enig should never be thicker than 5 micro inches max. or it will cause embrittlement. This process does self limit but it can put on as much as 10-14 Micro inches which would be a major cause of concern.