Electronics Forum: black nickel (Page 4 of 10)

Black Pad Other Plagues Of ENIG

Electronics Forum | Fri Dec 29 16:05:56 EST 2000 | Dave F

I don't know how I ended-up reading a current trade journal, when I have a stack of intentions behind my desk a foot and a half tall, leaning like a paper Tower of Pisa threatening to avalanche itself onto the underfill materials study, a meager one

ENiG or IAg? Which is better?

Electronics Forum | Fri Mar 14 11:04:54 EDT 2008 | herman

Samir, To correct some misconceptions on the answers to your question, and "what you know from experience": With both ENIG (Electroless Nickel/Immersion Gold-IAu) and IAg (immersion silver), soldering does not take place to the gold or the silver. Wh

Re: Poor solderability

Electronics Forum | Mon Feb 14 12:19:32 EST 2000 | Dave F

Dean: I associate black plague as an immersion gold process problem (although I could easily be wrong): Everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive. The immersion gold works by corroding the nic

HASL vs. ENIG

Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny

Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

Black pad defect

Electronics Forum | Wed Apr 02 23:21:24 EST 2003 | scottf

Make the move to Silver Immersion, no nickel to mess with!

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner

| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins

Black Pad

Electronics Forum | Thu Apr 24 15:48:09 EDT 2003 | razor

Known: During PCB maufacting nickel alloys are used for corrosion resistance during gold immersion process. A nickel alloy with a high phosphorus concentration will cause a weak connection interface. Question: Is the concentration of phosphorus in ni

Black pad defect

Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef

What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship

Black Pad

Electronics Forum | Fri Apr 25 08:09:13 EDT 2003 | razor

Thanks for response. I do wish to qualify that I got the alleged role of Nickel use for corrosion resistance from an article authored by Jason Gjesvold, IS IT REALLY BLACK PAD?, "Phosphorus rich Ni alloys are often used for corrosion resistance duri


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