Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch
I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than
Electronics Forum | Tue Mar 11 08:33:31 EST 2003 | davef
SMTA [www.smta.org] New On-line Presentation - March 14 Dealing with the Black Pad Defect in Manufacturing Solectron Vice President of Technology Srinivas Rao And Director of Process Integration Kim Hyland Date: Friday, March 14 Time: 10:30AM - Noon
Electronics Forum | Mon Mar 17 18:11:32 EST 2003 | davef
Converting to immersion silver is the best solution to the "black pad problem".
Electronics Forum | Wed Feb 12 09:42:46 EST 2003 | genny
The issue is on the web. The current issue is February, so check for past issues at http://www.circuitsassembly.com/
Electronics Forum | Thu Feb 20 10:48:01 EST 2003 | bernard
Hi Jodi, You helped write the circuit assembly article , so why the question ?
Electronics Forum | Thu Feb 20 16:30:36 EST 2003 | larryk
Maybe she wanted everyone to read her article?
Electronics Forum | Fri Mar 14 14:55:48 EST 2003 | Paul.malone@teradyne.com
What current desity package would you draw the line for the use of ENIG (imm. IO count/ etc
Electronics Forum | Wed Apr 02 23:21:24 EST 2003 | scottf
Make the move to Silver Immersion, no nickel to mess with!
Electronics Forum | Wed Mar 19 09:59:45 EST 2003 | davef
Jodi What's your thinking on the black pad rework technique proposed in: �A Failure Analysis And Rework Method �� Z. Mei, et al, SMTA International 1999, p407
Electronics Forum | Thu Mar 20 09:50:42 EST 2003 | Jodi Roepsch
We have not found a way to rework boards successfully at this time. Boards with severe black pad get scrapped.
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