Electronics Forum | Tue Feb 04 08:32:49 EST 2003 | roertner
In my experience AOI's are good for checking machine setup I.E. first piece inspection. After that the only things they will typically catch are wrong parts, reversed parts, missing parts, and tombstones. I would however suggest getting an AOI with a
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Tue Jan 15 12:20:16 EST 2002 | cfraser
This sounds like it could possibly be a case of Black Pad. We have had a few issuses with this in the past as well. Who the PWB vendor? I also recommend searching the archives and doing some solder samples with nonpopulated boards
Electronics Forum | Wed May 28 19:21:09 EDT 2014 | hegemon
Just from the look of things (a picture) I would first guess it is a contamination problem on the PWB. Check over all your handling practices. Make sure the PWBs are NEVER touched by bare hands. I would not rule out the Black Pad phenomena, but i
Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Thu Nov 07 15:33:02 EST 2013 | mleber
Below are a few photos of an ongoing issue we are having with 1 pwb style. Some of the pads appear to have contamination that appears after the selective solder step. The joints are extremely hard to rework - almost impossible. We had the joints anal
Electronics Forum | Thu Jan 30 15:41:52 EST 2003 | MikeF
The easy part is to determine which parts should be coated. The harder part is making sure the parts that should not be coated do not get coated. I don't even want to think about the amount of labor and materials I've lost due to conformal coat get
Electronics Forum | Tue May 30 21:09:30 EDT 2000 | Dave F
Dennis: Direct metalization is more of an European phenomena than a US one. Not to say that good things don�t come out of Europe. As background: Direct Metallization. In circuit board fabrication, an alternative to electroless plating makes the
Electronics Forum | Sun Sep 08 19:58:57 EDT 2002 | dasal
My specialty. Your right, Most corrugated contains S02 and the pallet is usually out gassing formic acid as well. Not a great environment for silver. Original press release follows: Reactive Polymers At AT&T Bell Labs, John P. Franey has developed
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