Electronics Forum | Thu Mar 25 19:01:57 EST 2004 | Dreamsniper
Oh Wow! Thanks a lot guys...I learned a lot from your good and spot on knowledge. You guys are really very helpful. Thanks Dreamy
Electronics Forum | Thu Mar 25 12:20:21 EST 2004 | Mike Konrad
OK� Nap time�s over! Technically speaking, water soluble flux is just that, soluble in water. Technically speaking, one does not need a saponifier or any other chemical agent to remove water soluble (OA) flux residues. However, one must conside
Electronics Forum | Sun Feb 22 15:46:09 EST 2015 | slave2anubis
Hi, my name is Dacian, and i run a mobile phone repair shop in Timisoara, Romania. Lately we decided to do more advance motherboard repair jobs, and a big problem that we have is, cleaning the board after we remove the chips. We repair manly iPhone,
Electronics Forum | Thu May 05 09:17:58 EDT 2005 | jimmiem
I tried soldering to several of the black pads and was successful, the solder stuck with no hesitation. so i guess this is not truly "black pad"? would that be a correct statement? What causes this blackening that looks like oxidation under the mic
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty
| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Tue Sep 20 13:10:24 EDT 2016 | ladmo1
Have you encountered this? There is black plastic from underneath the chip - oozing out between some of the solder. Like the part melted from underneath. It wasn't even under the chimney and had no direct heat on it. I am afraid if I try to remove
Electronics Forum | Tue Jun 25 15:42:39 EDT 2002 | Daan Terstegge
Hi Steve, To my opinion your peak temperature is a little low. If you are sure that the BGA (especially the balls under it) reaches this 205 degrees then it should be OK, but if you measured somewhere else on the board then it's probably better to r
Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon
| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection
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