Electronics Forum | Tue Aug 25 03:24:11 EDT 2009 | fiona_j
Hello, I have been recently bringing a new RoHS wave soldering machine into production. Unfortunately, I am finding many of the boards are experiencing blow holes. It is always silver plated PCBs and I believe it is related to moisture ingress. I n
Electronics Forum | Thu Dec 28 16:20:12 EST 2017 | rgduval
Pictures of your issues would help us to help you. Pin holes/blow holes are generally caused by either moisture or flux volatiles/organics. Since you've virtually eliminated moisture, it might be time to look at your paste/flux. You can call eithe
Electronics Forum | Sun Aug 15 11:02:37 EDT 1999 | Jeff Ferry
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Mon Mar 24 08:57:20 EST 2003 | russ
I don't know if I would call it a "blow hole". what I believe happens (I don't have a camera to watch spheres during the reflow process) is that when the flux starts heating up, expansion, bubbling, or something physically displaces the balls. We fo
Electronics Forum | Fri Oct 02 01:21:08 EDT 1998 | Mike Cox
Kyung Sam, | | Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or
Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Thu Oct 12 16:55:19 EDT 2006 | realchunks
This type of testing is only done to verify your reflow process. It is destructive testing and should not be performed on product reaching your customer. Solder is only used to provide the electrical connection from part to board. As a metal it is
Electronics Forum | Tue Jan 12 15:11:20 EST 1999 | Earl Moon
| | I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.
Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef
Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of
