Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko
Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N
Electronics Forum | Sat Mar 21 09:09:40 EDT 2009 | davef
Your puzzlement about blowholes in PTH solder connections during reflow soldering comes from: * Boards are hydroscopic. So, moisture content of the board is uniform. * Gold plating is uniform. * Nickle plating is uniform. * Copper plating on your PTH
Electronics Forum | Thu Aug 10 05:53:10 EDT 2000 | pascal MATHIEU
hello everybody , i am looking for the elementary caution you need to take when you reflow large board with several thousands of smt components . thank you for your advise
Electronics Forum | Tue May 04 10:59:23 EDT 2004 | Evtimov
Hi, It depends of your boards(are they for SMD or not) and how many boards you assemble. The process at all is like that: 1.Stencil printer - to adjust the paste 2. Pick and place machine(for your quantity) 3.Reflow oven Theese are the machines you
Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn
Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top
Electronics Forum | Wed Nov 15 15:51:21 EST 2006 | RJ K.
I have been looking into buying a rework station like ERSA or PDR. What I am questioning is how well will these systems reflow BGA's with metal top/cover that are reflective. In addition, when preheating the board would dark body packages absorb te
Electronics Forum | Thu May 06 18:36:06 EDT 2004 | gustavo
I can help you, if define what type of components you used: Thru hole(axial,radial, pin insertion etc..) axial: milimetrics or standar(span of .200" or .350" ) radial 2.5mm , 5mm or 7.5 mm SMT (chip shooter(1206,0805,0603 ,sot 23 etc or more small
Electronics Forum | Thu Aug 10 21:59:14 EDT 2000 | Dave F
Pascal: Two elementary cautines are: 1 Don't dump the board before the reflowed solder is cooled. 2 Try to manage the side to side temperature variations in your oven. I wouldn't be surprised to see 5�C variation. Good luck
Electronics Forum | Mon Nov 01 06:19:45 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
Electronics Forum | Mon Nov 01 06:27:15 EST 1999 | Michael Fogel
I suggest tow more ways: 1. try to differ the temperaturte between top and bottom side duering the reflow process. 2. try to add some glue dots under the falling parts befor the placement/reflow process Good luck Michael
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