Electronics Forum: bn 300 (Page 1 of 1)

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood

We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg

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