Electronics Forum: bn 300 (Page 1 of 1)

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood

We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg

  1  

bn 300 searches for Companies, Equipment, Machines, Suppliers & Information

Software for SMT

High Throughput Reflow Oven
Void Free Reflow Soldering

High Precision Fluid Dispensers
Thermal Interface Material Dispensing

World's Best Reflow Oven Customizable for Unique Applications
Pillarhouse USA for Selective Soldering Needs

High Resolution Fast Speed Industrial Cameras.