Electronics Forum | Thu May 27 14:44:05 EDT 1999 | Deon Nungaray
| One of our board fab houses is asking (again) to eliminate the reference designators and polarity markings from boards. This isn't feasible for thru-hole, but what is the industry trend on surface mount assemblies? | Deon Response: Hi Greg, Fr
Electronics Forum | Thu May 27 09:07:16 EDT 1999 | Sergio Luiz Vito
I am Looking for more information about chip on board process (COB process) for low cost products. Someone have experiencies with this process? Thanks a lot eng. Sergio Luiz Vito Process Depto.
Electronics Forum | Wed May 19 17:35:51 EDT 1999 | John O'Brien
Anyone have experience in marking boards with data matrix symbols? inline? Laser or ink or label? The objective is serialization and total traceability. I'd really like to speak to you about it!
Electronics Forum | Tue Mar 09 12:57:43 EST 1999 | Jan Pasternak
I want to identify a pre-production prototype test house to evaluate new parts in the Chicagoland area. Capability of running high speed pick and place and soldering components to test board.We will submit boards and parts.
Electronics Forum | Fri Jan 22 18:05:44 EST 1999 | David
Could anyone send me equations to calculate controlled impedance of traces on circuit boards. I am most interested in the buried traces in multi layer boards. Thanks, David - piengr@verinet.com
Electronics Forum | Fri Jan 22 17:38:07 EST 1999 | Michael Larsen
| | I was just wondering what solutions are out there for dry storage. Our basic need is to be able to store boards that have been baked and need to remain moisture free for up to a week. | | | Michael: Let's take a different angle on this. Why
Electronics Forum | Fri Jan 22 11:03:46 EST 1999 | TODD ROBINSON
WE ARE USING A SMT CERAMIC RESONATOR ON A COUPLE OF OUR BOARDS AND THEY ARE CAUSING FAILURES, DUE TO UNCLEANLINESS UNDER THE PART. WE NEED A WAY TO STAND THIS PART UP OFF OF THE BOARDS, OR IF ANYONE CAN SUGGEST ANOTHER WAY AROUND THIS? THANK YOU, TO
Electronics Forum | Wed Jan 20 14:21:54 EST 1999 | Dave F
| I need some opinions (And I know everybody has one). | I am mounting a board into a case, after mounting the board | I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" dire
Electronics Forum | Sun Dec 20 00:29:45 EST 1998 | Hallj
Once the machine has finished placing all th parts is there a way to slow down the speed at which the machine lowers the board back to the conveyors? Or are added board supports the only option?
Electronics Forum | Tue Oct 06 16:50:51 EDT 1998 | Manish
Hello Everybody Would anyone of you know about the impurities in the Ni/Au pad metallurgy (board side metallurgy) affecting the assembly of the chip on the board. I was told that impurities in gold may lead to void formation in the solder bumps.
Major in whole line of SMT equipment, especially in Mounting And printing and AOI SPI, Serve Parts and acceccories.
Training Provider / Manufacturer / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Floor 1,D Building,B area,Dongsheng Techwin Park,Bao'an District
Shenzhen, 30 China
Phone: 008618566662725
