Electronics Forum: board (Page 350 of 1639)

Second Pass In Wavesolder

Electronics Forum | Thu Jan 03 06:45:42 EST 2002 | Scott Davies

Hany, Tg is "Glass Transition Temperature". For an informative explanation of what this is, take a look at; http://www.psrc.usm.edu/macrog/tg.htm MLB = Multi Layered Board Does the board which you have the problem with only pass through the wave

Baking time for PCBA rework

Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette

Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w

ESD suitability of bare wood

Electronics Forum | Thu Feb 07 16:12:17 EST 2002 | Phil the Quality Guy

Recent discussions have risen lately regarding the in-house transferring and handling of populated printed circuit boards using unpainted wooden slats with notches cut in them. Wood may be at the high end of the neutral triboelectric scale but does

BGA ball to pad ratio

Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf

I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....

BGA ball to pad ratio

Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf

I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)

Missing component benchmarking

Electronics Forum | Thu Mar 14 23:20:05 EST 2002 | alanwilson

Missing and misplaced components could be down to board supports set too high or too low. Check the ZO and make sure the deflection is set ok at various points across the board. Check the other usuals such as sticking nozzles, correct size nozzle for

Fuji IP3 clamping problem

Electronics Forum | Wed Mar 13 14:17:03 EST 2002 | dougt

Are these sensors the reflective type? Maybe when the board is unclamped and it goes over the sensor it is seen, and then when it is clamped (raised) it is now out of the range the sensor was set for. That should be easy to adjust. A problem I've

Fuji IP3 clamping problem

Electronics Forum | Tue Mar 19 16:55:54 EST 2002 | Steve E ( Fujiamerica )

This problem happens when a dark part is placed where the main conveyer stop sensor is located.The machine does a board check ( back to loading pos ) . If a part is under the sensor it absorbs the beam and the machine thinks there�s no board. The ta

Chip crack at what stress.

Electronics Forum | Thu Mar 14 09:21:38 EST 2002 | davef

You should be looking for a better method of depaneling your boards. Listen. If you breaking components, it's not the component. It's you. Either you are: * Applying too much force. * Bending the board too much. * Locating the components too clos

Circuit/Trace cutting

Electronics Forum | Fri Mar 15 14:27:21 EST 2002 | stefwitt

Assuming, you have nothing on the other board side, I would drill a hole through the trace and board with a step drill and a drill press. If you adjust the depth control carefully the wider step of the drill scratches the surfaces of the trace to mak


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