Electronics Forum | Wed Feb 18 12:32:59 EST 2004 | babe
A hot plate should do it. Since your throwing the board away a good hot plate could get you to just above reflow topside and you could remove them all at one time. To do this however the bottom side of the board would probably be damaged, but you don
Electronics Forum | Mon Mar 29 07:21:51 EST 2004 | jdumont
We are also having the same problem here. I was told earlier that it could be a problem with the solder mask during the raw board manufacturing level but then I noticed that the problem was only surfacing on boards that went through the wave. As far
Electronics Forum | Tue Mar 30 02:58:55 EST 2004 | Grant Petty
Hi, Thanks for the ideas. With the solder mask curing problems, can you normally wipe off the white residue, as we can do this on our boards with our fingers. It's almost like the surface of the board has a "wet dried up" look to it, and it's a smok
Electronics Forum | Thu Apr 01 09:10:55 EST 2004 | cyclopsn
We are currently using non clean paste and non clean flux in our manufacturing process. But recently our customer feedback that using a non clean process might cause flux blockage in via hole area and potentially might burn or explode the boards over
Electronics Forum | Wed Apr 14 12:23:59 EDT 2004 | Ted
Hi everyone! I am looking for a lead-free solder that will survive a customer reflow of 260C. I am currently using SN10/Pb88/Ag02 but the reflow temperature is to high (320C) for the FR4 boards that we have. I know there are higher temp FR4 boards
Electronics Forum | Wed Apr 28 10:29:04 EDT 2004 | dougt
By "placement pressure" I assume you mean force. I don't know of placement machines that have transducers mounted on the placement spindles that actually measure force. We made a board with a force sensor mounted through a hole so that it was the sa
Electronics Forum | Fri Apr 30 15:11:53 EDT 2004 | pjc
MPM has a new board support system called GelFlex. It can be used on UltraPrint 2000 machines as well as AP series, UP1500 and AccuFlex models. For more info, go to http://www.speedlinetech.com/mpm/gel-flex.aspx also, contact Chris Wild at Speedline
Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2
Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo
Electronics Forum | Fri May 21 20:48:09 EDT 2004 | My Nguyen
I read the messsages but I did not meet my need. We currently have Excellon and ATI machines. They work ok for thick boards (40 mils and above) but for thin, small boards (15-20 mils and USB side dimension), it did not fulfill our needs. So, pleas
Electronics Forum | Wed Jun 02 15:29:47 EDT 2004 | pr
Make sure the board is stopping at the center of the worknest or you will waste lots of time (you'll get software limit errors when you try to find fids.). If it's not in the center, you need to go in and reteach from scratch (doesn't take too long).
Major in whole line of SMT equipment, especially in Mounting And printing and AOI SPI, Serve Parts and acceccories.
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