Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW
If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap
Electronics Forum | Mon Apr 25 17:07:11 EDT 2005 | rush316
You indicate that PBBs and PBDEs are included in FR4 materials!! Does this include PCB (Printed Circuit Boards)??
Electronics Forum | Tue Jul 11 11:18:06 EDT 2006 | dougs
Thats a good point SWAG, i'll look into that for the next run of these. cheers
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Mon Mar 26 16:58:53 EDT 2018 | solderingpro
Is there anything stopping you from replacing the flat belt solution to a continuous running steel roller chain conveyor? - From there (depending upon board temperature) you should be able to buffer your boards in a vertical buffer station if neede
Electronics Forum | Thu Mar 31 11:15:25 EDT 2022 | proceng1
So the NEW component is SOT-23? What is the foot print on the board?
Electronics Forum | Wed Aug 21 10:26:08 EDT 2002 | stownsend
We are using OSP coated boards and no-clean solder paste. In a few instances, we are seeing increased distortion in an audio circuit. Has anybody seen or heard of surface insulation resistance (SIR) decreasing after reflow on OSP boards? Is it possib
Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef
We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b
Electronics Forum | Fri Sep 12 09:10:23 EDT 2003 | Norm Morikawa
Around 1989 I had this probelmm with a SMT CCA that would not solder in one area consistently. I had it cross sectioned by the bare board supplier and found that under their metallurgical microscope the thickness of this HASL bare board could not be
Electronics Forum | Thu Jul 14 11:04:53 EDT 2005 | dougs
yes SPC can be used on a wave solder machine, you should use a c-chart to monitor the amount of defects per board or group of boards, this will let you know if your process is stable, as you improve your process you should re-calculate your UCL, hope
