Electronics Forum | Thu Nov 11 10:51:16 EST 1999 | KenF
Could anyone tell me where I can find some literature/standards describing the dimensions and solder land sizes of all common SMD components available in the market? IPC-SM-782 does provides some but not all. Thanks in advance for any response. Rega
Electronics Forum | Wed Aug 05 02:20:19 EDT 2015 | preeti1203
Any dimensions.. it could be from pad to pad or board outline.
Electronics Forum | Thu Nov 11 11:38:39 EST 1999 | John Thorup
Try the Professional SMT Component and Land Pattern Book from SMT Plus. Link below. John Thorup
Electronics Forum | Thu Nov 11 13:03:01 EST 1999 | Jeff Sanchez
Thanks John, That's a nice site. It had some good training stuff as well. I had seen a thread here on the forum for this same question and someone posted this link www.practicalcomponents.com . It gives all the package sizes and dementions as
Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Sat Nov 13 03:10:36 EST 2021 | pti88
why poor contact between PCBA board and probe？ When I used ICT to test PCBA board, there was poor contact between board and probe .
Electronics Forum | Wed Nov 17 20:11:29 EST 2021 | dwl
is there flux on the board? are you probing a test point or a soldered pad? is the probe hitting the right spot?
Electronics Forum | Sun Nov 14 11:14:50 EST 2021 | kylehunter
> why poor contact between PCBA board and probe？ Why ask a question with 0 information and some how expect an answer?
Electronics Forum | Fri Mar 27 06:16:24 EST 1998 | mancheol,seo
Hello everyone~! I wonder becasuse of stencil board size. My component dimension is 200 x 200mm What the board size I choose? Please let me know solution... best regards man from korea
Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park
Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav
