Electronics Forum: board and dimensions (Page 8 of 108)

Does any factory can produce 4 layers blind board with 3 OZ inner and outter layer copper

Electronics Forum | Thu Mar 12 08:38:47 EDT 2020 | floravictor

Hi, We can produce such pcb, we are pcb factory in Shenzhen. my skype: qjthomasxiao mail: victor@flora-ltd.com

Does any factory can produce 4 layers blind board with 3 OZ inner and outter layer copper

Electronics Forum | Fri Jun 12 09:10:48 EDT 2020 | apcpcba

Hello, we can meet your request, welcome to visit our website: https://www.apc-pcbassembly.com/

Does any factory can produce 4 layers blind board with 3 OZ inner and outter layer copper

Electronics Forum | Tue Mar 10 04:37:44 EDT 2020 | luciano_zhang

I have a files need produce in a urgent time. It's 4 layers PCB with 3 OZ inner and out layer quantity need 10000pcs ,any one know which supplier is aviliable?

Does any factory can produce 4 layers blind board with 3 OZ inner and outter layer copper

Electronics Forum | Thu Jun 11 09:28:57 EDT 2020 | pcbkathay

Dear Luciano, We are PCB manufactured based in China,we can produce the PCB as your requirements as soon as we can, please send the files to my email 284816044@qq.com looking foward to your email.

Fuji CP6 and IP3 specifications request

Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf

•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef

People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t

Pad and Component Dimensions

Electronics Forum | Mon Jun 02 11:36:23 EDT 2003 | swagner

A good place to get the data you are interested in would be Philips CFT design guidlines.

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |


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