Electronics Forum: board assembly bake out temp before coating (Page 1 of 1)

PCB SHELF LIFE AFTER FIRST REFLOW

Electronics Forum | Mon Feb 09 09:00:17 EST 2015 | jax

Outside the MSD issues stated already (and I cannot provide a exact time not knowing multiple factors like Humidity levels, temps, exposure times, etc...) OSP might be the very worst finish to use in this scenario of side 1 / store on a shelf / side

Military Lamina bake-out

Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef

IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for

Re: Drying ICs any advice

Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson

| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin

Re: Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Thu Sep 30 12:29:01 EDT 1999 | Dave F

| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne

Re: Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Thu Sep 30 21:37:44 EDT 1999 | Dreamsniper

| | Hi everyone, | | | | Greetings! | | | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | | Insufficient Solder an

Re: Board Warp And Twist

Electronics Forum | Thu Aug 10 13:12:10 EDT 2000 | Bob Willis

You may care to review the following from my Circuits Assembly page on line. "HOW FLAT IS FLAT AND DO WE NEED FLAT CIRCUIT BOARD, YES WE DO ? As production problems go there is one that keeps reoccurring time and time again. The blame is usually di

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

Re: No Free Beer But...

Electronics Forum | Mon Oct 19 14:24:06 EDT 1998 | Justin Medernach

| | | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | | Q:

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board assembly bake out temp before coating searches for Companies, Equipment, Machines, Suppliers & Information

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