Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Mon Jan 24 20:46:07 EST 2022 | emeto
Hello, we have a stiff board that goes to HLA, where some force is applied over the board to make it fit in. This force creates some deflection/bending of the PCBA and in result we see some functional failures. I wonder if there is any standard that
Electronics Forum | Sat Nov 18 08:42:11 EST 2006 | davef
Bow & twist: IPC-A-600. Acceptability of Printed Boards 1.5%; Goal 0.005" per inch; Practicle 0.007" per inch
Electronics Forum | Mon Nov 20 19:49:03 EST 2006 | davef
Sorry for stating this incorrectly. It should been: Bow & twist for bare boards and panels: IPC-A-610 Acceptability of Electronic Assemblies, 10.6: 1.5% for PTH only and 0.75% for SMT, acording to test method TM-650, method 2.4.22 IPC-6012, par. 3.
Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef
There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height
Electronics Forum | Mon Jun 19 08:45:55 EDT 2006 | dougs
Hi All, We have a board that's going through our process at the moment, it's 1.6mm thick and has 4 wires soldered into it, these are 10SWG multi stranded wires, i'm finding that it's difficult to get the holes filled with solder as it travels up
Electronics Forum | Mon Jun 19 22:47:36 EDT 2006 | davef
So, a 10SWG is about an 8AWG. We can't think of a IPC standard for design of this type of product. That the solder is running up the wire indicates something is wrong. We wonder if either: * Holes in the board might be too large for the wire. Doe
Electronics Forum | Wed Nov 18 12:59:49 EST 1998 | Earl Moon
| Our company has been building high rel military products for over 15 years. Over that time we have reduced our bare board suppliers to two companies that specilize in 55110 QPL product. | | I am now faced with a requirement for 6000 4 layer boa
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Thu Nov 22 23:46:27 EST 2018 | jaypark
Some PTHs on a board in the product I am building are not filled enough to meet the IPC-610-F requirement(at least 75% vertical fill) . I have no access to the solder source side due to something installed right beneath it. In order to completely
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