Electronics Forum | Fri Oct 18 13:36:27 EDT 2002 | nwyatt
Sounds like you are a CM. In that case, I would suggest that you do profile every new product that comes through the door as a way to cover your a** to your customers. In the offchance that your customer requests to a see a copy of your oven prof
Electronics Forum | Mon Dec 02 10:45:04 EST 2019 | slthomas
*You* may be well versed, but not every designer is experienced or even familiar with DFM. I don't care how sophisticated the circuitry is, if you can't build it it's a lousy design, and as an EMS we see many designs that shouldn't have passed the
Electronics Forum | Tue Dec 08 16:53:41 EST 1998 | Ryan Jennens
Hey there Dave! We used to use a batch cleaner when we used water-clean paste. It was similar to a dishwasher, except that it had a digital menu for entering the number of wash cycles, water temp., amount of saponifier (we just used DI water),
Electronics Forum | Mon Jul 17 13:37:35 EDT 2006 | carln
Here is something I copied from Circuitnet.com. This appears to answer your question and then some... http://www.circuitnet.com/experts/ Ask the Experts Jul 17, 2006 What type of cleaner method is preferred for lead-free stencils? What type of s
Electronics Forum | Tue Aug 02 23:02:04 EDT 2005 | crishan
Assuming it is not PCB supplier related, here are my thoughts; 1. CHK Component density top / bottom, I am assuming you do bottom reflow first then top. If have alot of heavy comps on bottom it might cause the board to sag in the middle. 2. You hav
Electronics Forum | Fri Nov 06 08:50:07 EST 2009 | jeffreyj
adlsmt - I do apply paste (Kester EP256) by hand to the boards now with 5 mil thick stainless steel stencils. A few of the parts almost always need rework, though, either because I didn't place them accurately or there's too much paste, or it got sme
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Tue Dec 08 18:40:04 EST 1998 | Graham Naisbitt
Hi all, Only observation I would make is that it depends upon what you term as clean? Now isn't that an old thorny question. Care to comment? Regards Graham | Hey there Dave! | | We used to use a batch cleaner when we used water-clean paste.
