Electronics Forum | Fri May 29 07:17:30 EDT 2015 | kkay
We have a small board about 1" by .5" and it is .012" thick. It is in a 50 up panel. We have tried rat bites and v-score and we keep seeing delamination around the edges. Anyone have experience depaneling boards this thin?
Electronics Forum | Mon Jun 01 12:02:03 EDT 2015 | kkay
They are too small to use on our router. Is there a way to cut boards with a press?
Electronics Forum | Mon Jun 01 11:01:46 EDT 2015 | tnisbet
Have to tried an automated system such as a Router or Press? tom@goppm.com Tom Nisbet
Electronics Forum | Mon Jun 01 10:14:55 EDT 2015 | swag
Wow that's thin. We do lots of flex = similar thickness. We do most on a router but in a pinch we cut them out with a good pair of scissors.
Electronics Forum | Mon Jun 01 18:12:12 EDT 2015 | comatose
I've done V score that thin, but it takes some doing. Using a twin linear knife type machine. In quantity this seems like a perfect job for laser, though.
Electronics Forum | Thu Jul 09 05:52:49 EDT 2015 | kfquan
Have you tried the so called push-back or re-insertion type panel? 5mm*12mm*0.3mm thick FR-4, 120-up panel is doable.
Electronics Forum | Tue Jun 02 09:32:24 EDT 2015 | tnisbet
Have to tried an automated system such as a > Router or Press? > > _a class=roll > href="mailto:tom@goppm.com"_tom@goppm.com_/a_ Tom > Nisbet .012 Is too thin for our Press & Die. How are you fixturing the panel on your router ? Do you have a d
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Tue Jan 12 11:14:37 EST 2016 | mfgengr2016
After the CCA is been de-paneled I find exposed board fibers. Should the board edge be sealed with an epoxy to keep moisture from getting into the CCA?
Electronics Forum | Fri Aug 20 10:47:05 EDT 2010 | dschlo
I am looking for a company that recycles the scrap created when boards are depanelized. Specifically for CEM3 Material.
