Electronics Forum | Mon Nov 08 11:01:12 EST 1999 | Brian Larson
We are leaving 12-18 thousands material when scoring. Several components are cracking during depanelization. The pizza cutter machines out there are either too expensive or too slow to solve our problem. I am looking for a magical solution. In case
Electronics Forum | Mon Jun 22 21:31:43 EDT 1998 | Dave F
| Dear collegues, | I like to have your comments/ experience with various methods of depanelization like routing, scoring, cutting etc. | Any feed back on the equipment used with company addresses will be highly appreciated. | Please identify if pos
Electronics Forum | Wed Jul 26 10:42:43 EDT 2017 | proceng1
We have an array of boards that are difficult to depanel due to components being close to the edge. I want to route a space between strips (boards are 14" long x 1" wide) and have breakaway tabs like mouse bites, but the customer won't accept the ja
Electronics Forum | Mon May 14 16:20:55 EDT 2007 | realchunks
Hi C-Dig, Are you testing circuit boards on a static mat? It could be conductive, which might short things out. I've seen this happen to our bench techs. You might want to look at getting a set of helping hands. The gizmo that actually holds the
Electronics Forum | Fri May 11 17:21:04 EDT 2001 | davef
Three main groups of depaneling equipment are: 1 Scoring: Limited to straight edges and mainly 90� angles 2 Routing: And a cloud of dust 3 Singulating: Hard tooled by board To get started understanding the suppliers look here: http://www.cassembly.c
Electronics Forum | Wed Oct 26 11:51:06 EDT 2005 | moonshine
Don't V score, unless you absolutely have concurrence with your QUALIFIED fab and assembly operations. Routing is best for all chip devices close to board edge. It's better and cleaner for everything when seeking quality and reliability. Visit htt
Electronics Forum | Wed Oct 26 16:47:17 EDT 2005 | jdengler
I have never heard of heating the board for separation. You may want to try some of the following. -Using a roller cutting type depaneler helps reduce the stress. -Using a combination of routing in areas with components near the edge and v-score th
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
