Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Wed Jul 13 05:17:56 EDT 2016 | salini
How the moisture is not effecting the moisture sensitive devices after board assembly solder process when kept inside a cabinet with IP 20 rated?
Electronics Forum | Wed Jul 13 11:59:06 EDT 2016 | emeto
Moisture before reflow is consideration, because damages parts and boards in the reflow process. It is all about this water expanding as gas and cracks part or causes PCB delamination. Moisture after reflow is still affecting the work of the product
Electronics Forum | Wed Jul 13 17:50:26 EDT 2016 | davef
From "Assembly" magazine, "Moisture-Sensitive Devices" [ http://www.assemblymag.com/articles/85082-moisture-sensitive-devices ] ... a description of the moisture sensitive device problem. I agree with Evtimov * During board assembly solder process,
Electronics Forum | Wed Jul 04 13:25:03 EDT 2012 | davef
Baking boards to remove moisture takes a lot more energy than you'd think. Following on with this, Chris Hunt from NPL gave a presentation at IPC APEX 2012 about the results of his research ["Impedance Testing for Sensitivity to Delamination in Print
Electronics Forum | Mon Jun 27 14:20:57 EDT 2005 | Bob R.
If you visually inspect the solder joints of the first dozen or so boards with the Pb free parts and you're meeting workmanship standards then I wouldn't worry about it. When we started getting the first barrage of Pb free parts a couple years ago w
Electronics Forum | Wed Dec 08 09:53:23 EST 2010 | fönsi
Hello Because of the cold weather, we had some troubles with drying out of printed solder paste on the pcb's. The relative humidity in the air declined below of 20%. We have a process window of store the printed board for maximum 24 hours, but with
Electronics Forum | Tue Jan 13 15:48:58 EST 2015 | natashakt
170 degrees Celsius) and regular FR4 materials. I am trying to see if we can use table 5 on page 14, "Recommended Equivalent Total Floor Life (Days)" to find out how long (at specific humidity and temperature) our populated and unpopulated PCB's can
Electronics Forum | Thu Sep 18 15:29:59 EDT 2003 | Gabriele
Hi all, by reading along those thread (SOT23) and Tan outgassing I learned plenty of things. My first time approacing this kind of Q$A Forum, very intesting tech communication way. Any way, the path of magnetism effect was chosen when time ago we met
