Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Thu Aug 17 15:09:24 EDT 2006 | slthomas
It sounds more expensive just at face value than better LEDs, and potentially MUCH more exensive due to failures if there is any kind of stress on that weakened connection.
Electronics Forum | Mon Aug 11 07:27:32 EDT 2008 | eyalg
We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress wa
Electronics Forum | Fri Feb 18 09:12:13 EST 2000 | Leslie Hall
Thanks Dave F for you 2 cents. You bring up some important points that what one person is doing isn't neccesary right for us. Someone might burn in their boards for 10 hours in temperature but their ramp time is only an hour versus someone else is
Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Fri Sep 10 09:39:32 EDT 2004 | Bryan Sherh
Dears, I've a board with OSP surface finish,and I planned to print solder paste on the test pad for easy ICT, because the probe can't reach the OSP covered pad.But to my surprise,after reflow there's much flux residue on top of test pad(or solder) an
Electronics Forum | Fri Aug 20 13:36:46 EDT 2004 | ttye01
We conduct temperature stress test (-40 to +100C)on our products which sits on our expensive test board. This stress test on our product shorten the life span of the test board due to the extreme temperature change. I have tried epoxy coating on the
Electronics Forum | Sun Aug 22 22:31:31 EDT 2004 | ttye01
Hi Dave, Thanks for the input. Will certainly take your advice. Thomas
Electronics Forum | Tue Jan 19 12:25:23 EST 1999 | Mike Cox
I need some opinions (And I know everybody has one). I am mounting a board into a case, after mounting the board I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" direction.
Electronics Forum | Wed May 02 22:14:21 EDT 2007 | DSD
The Philips Orion (Yamaha YV100) Head I/O Board is usually at fault as this tends to suffer trackwork problems with age due to the constant flexing of the board stressing the connectors on the board, thus breaking tracks within layers. You should not
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