Electronics Forum | Wed Jun 13 16:09:28 EDT 2007 | rgduval
The parts were soldered in place on the first side. Any recommendations on material for this kind of fixture? I've shimmed boards off the belt before with titanium wave plows...but, I'd love to find something slightly more elegant.
Electronics Forum | Thu Jun 14 04:08:33 EDT 2007 | d0min0
we had same problems with heavy loaded boards (40 x 10 leg transformer each side) we placed 2 glue dots (Fuji GL)under trafo and played with profile bottom side (thermateh lcv4 - 6 zones, SnPb process) that did the trick
Electronics Forum | Mon Jun 18 10:11:52 EDT 2007 | dyoungquist
Almost every board/panel we build is double sided and we use an MPM SPM screen printer with no problems. The screen printer is not the cause. We have seen heavier parts fall off the first side when going through the reflow for the second side. We
Electronics Forum | Wed Jun 13 14:48:48 EDT 2007 | rgduval
Is there a sort of standard method to prevent part loss in reflow? I've had a couple of situations come up recently where we've lost some parts during second-side processing. We're running an Heller 1800, with a mesh belt. Most items process fine,
Electronics Forum | Wed Jun 13 15:40:44 EDT 2007 | slthomas
Edited because I completely misinterpreted your post. We used 2 lengths of Durapol with slots for the board edges and a shorty (free-floating, not attached) under the middle. Not much more elaborate than your titanium shims but we had it laying aro
Electronics Forum | Wed Jun 13 15:56:35 EDT 2007 | ck_the_flip
I experienced this with a high-mass capacitor. I was able to turn down the bottom-side convection (around 50�C lower than each of the top-side heaters), and able to NOT lose any parts. I got the bottom-side part just slightly over liquidus, and min
Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy
1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3
Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
Electronics Forum | Wed Dec 04 04:29:51 EST 2002 | CH
U might need to run the board on a reflow pallet with a clamper. This will help to solve the warpage problem on the PCB and connector.
Electronics Forum | Fri Nov 22 13:41:55 EST 2002 | cristiano
We are experiencing problems with a smartmedia connector during the reflow solder process. The connectors stay a little bended after the oven. In this case the middle leads are not solded, because they stay with no contact on the board. The conector
