Electronics Forum: boarded (Page 1557 of 1639)

No Clean for BGA's

Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske

Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi

Rep Responses in Forum, Possible Guidelines

Electronics Forum | Thu Oct 10 17:08:09 EDT 2002 | russ

Sean, I personally do not have an issue with reps responding, actually I would encourage it! especially when someone is looking for a product or a process that is relevant to the reps scope of things. I do not like and I don't believe that it is ap

Stencil Printing Process Troubleshooting and control

Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas

Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi

Cleaning Oxides from BGA's

Electronics Forum | Fri Oct 18 21:23:55 EDT 2002 | caldon

David- You are correct!!! DING DING DING!!!! Here is an overview from the ACI website: ACI offers solderability restoration services by using Reduced Oxide Soldering Activation (ROSA) technology to remove the oxide layers from circuit boards or comp

BGA Short

Electronics Forum | Fri Oct 25 12:23:49 EDT 2002 | yngwie

Hi Experts, I'm facing short problem with BGA at SRT rework in one particular BGA. It is BGA, with a metal piece at the center like a coin. The BGA is located in between two high profile press fit connectors and the short always observed at the si

North Dakota State University New EM Lab Equipment Needs

Electronics Forum | Fri Nov 01 09:35:52 EST 2002 | James Bartlett

MINIMUM NDSU EMEG EQUIPMENT SPECIFICATIONS (11/1/02) To serve microsensor research and development via the Center for Nano-scale Science and Engineering (CNSE), the North Dakota State University (NDSU) Electronics Manufacturing Engineering Group (EM

PCB Pad lifted - repair

Electronics Forum | Wed Nov 13 22:30:05 EST 2002 | davef

Methods for performing repairs: * 7721 - Repair & Modification of Printed Boards & Electronic Assemblies. * On-line guides at Circuit Repair Technology [ http://www.circuittechctr.com ] site. Roughly from East to West, service companies that perfor

quad 4c

Electronics Forum | Wed Nov 27 18:10:41 EST 2002 | andrewbrook

Quad4C's have their moments. If the price is right and you are aware of the machines limitations then you will be satisfied. The placement rate is slow, 1.2 seconds/chip. Don't buy any Quad if it has the CyberOptics Laser unit, the Quadalign unit is

Imersion Tin - does anyone have experience ?

Electronics Forum | Thu Dec 12 07:37:13 EST 2002 | davef

Immersion plating appears like electroless, sorta, but is different chemically. Plating is converting metal ions in solution to metal on the board. Those metal ions are "converted" by adding electrons to them. The source of these electrons defines

Fine pitch paste release problems.

Electronics Forum | Mon Dec 16 10:23:42 EST 2002 | Grant Petty

Hi, I have checked the archives, but need some advise. We have a 256 pin 1 mm pitch BGA part of our boards, and we have having problems with paste release our of the holes for the BGA. We just cannot seem to get it right, and we have to keep the st


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