Electronics Forum | Wed Apr 07 14:43:27 EDT 1999 | Dick Casagrande
| | Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | | | I've seen QFP's on the backside and yes, they need glued prior to reflow - just a couple of drops on the corners. | | Scot
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.
When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc
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