Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
Electronics Forum | Tue Jun 14 18:26:32 EDT 2005 | GS
You can find useful informations also on last review of IPC-7085 : Design and Assembly Process Implementation for BGA. Regards GS
Electronics Forum | Tue Jun 21 11:46:04 EDT 2005 | kenscj
Hi dave, Thanks for the comment. I have another issue. The board already pass Test and Burn-In processes, but after 2 months the BGA contact is found open (no contact on certain balls). How can that happen? Is it during build, the solder ball alrea
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Wed Apr 14 19:47:13 EDT 2021 | solderingpro
Sounds like you may have already found the issue: inconsistency from your supplier. Seeing as Gold really doesnt oxidize and you're using an inert environment (N2 I suspect), I would turn my attention to the supplier. You said yourself, the "Shine
Electronics Forum | Fri Nov 08 08:52:54 EST 2002 | dphilbrick
Juan There are many things that cause this and the first thing I would do is request quality records from your board fab facility on that particular lot. If they are unwilling to give them to you this is a good sign they had a processing problem. Th
Electronics Forum | Tue Dec 15 22:23:52 EST 1998 | Erhan Kaya
If that's what you mean, here's what we call them: ROBBER PADS... Pretty close to the "thief" I guess. Those come with the design and if the wave soldering direction is not known at the time of design and/or there's no real estate limitation, the rob
Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef
What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship
Electronics Forum | Sun Sep 07 13:33:50 EDT 2014 | horchak
Edri PCBA design and pad geometry is one of the critical factors for BGAs. Typically the pad size for collapsible balls is 80% of the ball diameter. Pad size consistency is critical. In your situation what will happen the larger pads will wick the s
Electronics Forum | Fri Sep 05 09:15:36 EDT 2014 | rgduval
Hi, Edri, It's not uncommon for PCB fab houses to change pad sizes like that, due to design constraints....however, it always aggravates me when they do it without checking with me first. In my mind, that's the first sign of potential bad issues wi
.png)
