Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas
Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
Electronics Forum | Sun Sep 04 23:42:31 EDT 2005 | juan2208
hi all, i have a question about the wirebonding That is under what circumstances that the ball bonding is used and under what circumstaces the wedge bonding is used? thanx advanced.
Electronics Forum | Thu Jul 04 23:17:24 EDT 2019 | 123456789
Today we will talk some other problems you may meet in the wedge bonding work. If you have any other supplement or suggestion, welcome to leave us message. Appear welding spot indentation on the frame, what's the causes? How to solve? 1.The Wedge’s
Electronics Forum | Fri May 29 07:17:02 EDT 2015 | anirudh_thabjul
Hiee everyone, I am a Hardware Engineer and also a PCB designer. I am using a Microntroller which is in "CHIP PACKAGE". So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology". So, Can any one suggust 1. whi
Electronics Forum | Tue Oct 24 22:36:29 EDT 2000 | DL
On the main page of Smtnet towards the end of the opening paragraph states the following...Your " research continues in determining the reliability of thick film hybrid microcircuits and similar technologies using low-temperature, co-fired ceramics.
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Wed Jan 31 17:30:54 EST 2007 | GS
Thanks a lot flipit, I am not directly involved in this "problem" but is my friend that have his CM rejecting PCBs because it says the "+" mark (spokes lengths) are out of tolerances. It seams CM bonder's require tolerance +/- 0,05(? not sure). I d
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
