Electronics Forum | Fri Aug 29 09:39:08 EDT 2014 | rgduval
I'll try to deal with the issues as you've presented them. 1. Blistering/delamination, shown in photo 2. The most likely cause of blistering/delamination like this is moisture in the boards. The moisture can get into the boards in multiple ways..
Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian
Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to
Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Electronics Forum | Mon Aug 28 17:28:16 EDT 2017 | dekhead
Edge connector attaching to gold fingers?
Electronics Forum | Tue Apr 19 13:23:33 EDT 2016 | vchauhan
We are using Vicor SMT J-Lead VI Chip which is big component on the bottom side. The manufacturer recommends to have 6 mil stencil but the customer required 10 mil stencil. The PWB has gold contacts on both sides. We noticed some mini solder splashes
Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Mon Jan 15 03:42:08 EST 2007 | adamp
Hi all, Last week I have noticed, that solder changed colour in our Soltec wave soldering machine. I am using normal 62Sn37Pb alloy and it's colour changed to violet/darkblue with gold areas. I know that gold colour means that, there is to much Cu i
Electronics Forum | Tue Aug 13 09:31:48 EDT 2002 | ksfacinelli
I am looking at placing a Altera BGA device that has a .45mm Nominal Ball Dia. with a .8 spacing c-c between balls. The PCB will be gold plated so co-planarity should not be an issue. Interested in suggestions that may assist producability when pla
Electronics Forum | Tue Jan 16 18:13:25 EST 2007 | greg york
Try to process the composite pallet through the wave without any flux and view volume of smoke and if any residue is deposited in the wave when it exits. My guess is that the pallets are releasing some binders that are high boiling and this in turn c
Electronics Forum | Thu Jul 03 18:14:03 EDT 2003 | russ
Kris, I don't know what I HAVEN'T SEEN yet cuz I haven't seen it. (HAHAHA) It is kind of like when you are looking for something and you always say after you found it that it was the last place you looked (Why would anyone keep looking for something
.jpg)
